A wide range of techniques are available at our Curo Park laboratories to investigate failure in an electronic or electrical assembly. We also host Failure Analysis workshops with top UK electronics engineer and consultant Bob Willis. For details of the workshops follow the link to …http://www.askbobwillis.com/

Microsectioning plus Optical and Scanning Electron Microscopy

Standard metallography and Optical Microscopy can be carried out on solder joints or assemblies to determine the level of joint integrity, comment on causes of defects or failures, and evaluate microstructural features such as grain size or intermetallic layer thickness. The Scanning Electron Microscopy (SEM) is also fitted with an energy-dispersive x-ray (EDX) spectrometer. This device allows the chemical composition of the sample to be determined.

Mechanical Testing

The properties of solder alloys can be assessed using an Instron apparatus that is capable of the application of tensile, compressive, shear or cyclic fatigue loads. Testing can be performed at a range of temperatures, normally between room temperature and 300°C but low temperature work is also a possibility.
The Dage bond tester is designed for the evaluation of solder joints from actual assemblies rather than model joint configurations. The unit is capable of shear or pull (tensile) testing of solder joints; BGA’s and wire bond joints.

Reliability Testing

The reliability of electronics assemblies is often determined by their resistance to damage caused by temperature cycling effects. The environmental chambers in this laboratory are commonly used to thermally cycle printed wiring board (PWB) assemblies between temperature extremes to accelerate the failure mechanisms. Thermal Chamber Capabilitities.

Solderability Testing

Solderability assessment can be used for ensuring the quality of the materials entering the manufacturing chain. Solder pastes, fluxes, component finishes and board coatings can vary in quality and will always deteriorate if stored between manufacture and assembly. 

Soldertec Members receive preferential access to our laboratory services at a discounted rate.

Call us today to discuss your individual problems.
Contact:
Zoe Sullivan on +44-1727-871 307 or zoe.sullivan@itri.co.uk
Switchboard +44-1727-875 544