Solderability is an extremely important parameter for electronics assembly. The term is used to describe the wetting and chemical reactions that occur between a solder alloy and a substrate material for a given thermal profile under the influence of a flux. Soldertec uses a MUST II Solderability Wetting Balance.

The MUST II is a purpose-built instrument designed to assess the wetting characteristics of solder-substrate systems. The instrument can be configured to operate bath or globule testing, the latter using a small solder pellet on a heated stage that can be used to test individual leads, terminations or pads.

Solderability information can be useful at almost any stage of development and manufacture. Results obtained during R&D can help in the development of soldering materials and fluxes, processes and materials selection. Solderability assessment can also be used for ensuring the quality of the materials entering the manufacturing chain. Solder pastes, fluxes, component finishes and board coatings can vary in quality and will always deteriorate if stored between manufacture and assembly.

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Contact:
Zoe Sullivan on +44-1727-871 307 or zoe.sullivan@itri.co.uk
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