An Intel-sponsored research team at Carnegie Mellon University, US has announced the development of new 'magnetic nanocomposite' solders, heated by RF energy, that could significantly reduce energy consumption in soldering operations.

Though the development has 'a long way to go' before it could be implemented in actual solder joints, the research highlights  an important potential path to future solder technologies.

Nanoparticles of magnetic materials inside the new solders heat up in response to RF radation. This potentially uses much less energy than conventional processes using standard infra-red or convention ovens. The quantity and type of particles can be varied to control the amount of heat generated.

Initially the technology is being applied to component manufacture but could have wider application too.

An additional advantage to locally heated joints is that there is less effect of heating on other parts of the electronic components during processing, mitigating warping and degradation issues sometimes seen in conventional processes.

The work was presented at the 11th annual Magnetism and Magnetics Materials Conference Jan. 18-22 at the Marriott Washington Wardman Park in Washington, D.C., US.

More information, including a video interview, can be found on the university website link below.